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Journal of Electronic Packaging - ASME | 2024 Impact Factor: 2.3 | Cite Score: 5.7 | Q2

journal-of-electronic-packaging.jpg

Journal of Electronic Packaging - ASME | 2024 Impact Factor: 2.3 | Cite Score: 5.7 | Q2

  • About this Journal:
  • Peer-reviewed ASME journal publishing original research on electronic packaging and microsystems integration.The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
  • Emphasizes both experimental and theoretical work with engineering relevance and demonstrated applicability.
  • Serves academics and industry professionals working on thermal management, reliability, materials, interconnects, and packaging processes.
  • Includes invited review articles on emerging and high-impact topics in electronic packaging.

  • Editor-in-Chief:  Jin Yang

  • Scope of the Journal:
  • Thermal management and heat transfer in electronic systems and micro/nanoscale devices.
  • Materials, processes, and manufacturing techniques for electronic packaging.
  • Electronic and photonic interconnects, substrates, and assembly technologies.
  • Mechanical reliability, stress/strain analysis, and testing of packaged systems.
  • Microelectromechanical systems (MEMS) packaging, sensors, and small-scale systems integration.
  • Modeling, simulation, and experimental methods for design, testing, and optimization of packaged electronics.
  • Latest Research Topics for PhD in Computer Science
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  • Print ISSN:  10437398

    Electronic ISSN:  15289044

  • Abstracting and Indexing:  Scopus

  • Imapct Factor 2024:  2.3

  • Subject Area and Category:  Computer Science Applications,Electrical and Electronic Engineering, Mechanics of Materials

  • Publication Frequency:  

  • H Index:  65

  • Best Quartile:

    Q1:  

    Q2:  Computer Science Applications

    Q3:  

    Q4:  

  • Cite Score:  5.7

  • SNIP:  1.069

  • Journal Rank(SJR):  0.524